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REGISTER FOR THE 2021 HOOPS VIRTUAL SUMMIT SERIES!


HOOPS Virtual Summit Events 

Join us and our growing developer community as the Tech Soft 3D HOOPS Summits go virtual. The HOOPS Virtual Summits will feature inspiring and informative events for engineering software developers interested in technology trends and challenges facing our industry. Learn about new features in the 2021 HOOPS SDKs, find out how to leverage our tools and gain a market edge directly from our partners, and benefit from engaging demos from our experts.

Registration for each event is required and meeting links will be provided upon registration.  

HOOPS product update &
happy hour: North america 

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Wednesday, March 10th
1 PM - 2:30 PM PST | 4 PM - 5:30 PM EST 

Join the Tech Soft 3D team for a lively tropical themed Happy Hour as our product managers guide you through the HOOPS product portfolio. We’ll be discussing what’s new for 2020, what we have planned for the future, and how these developments are impacting applications from Manufacturing to Building & Construction.

Hoops product update &
happy hour: EMEA 

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Wednesday, March 10th
1600 - 1730 CET | 4 PM - 5:30 PM CET 

Join the Tech Soft 3D team for a lively tropical themed Happy Hour as our product managers guide you through the HOOPS product portfolio. We’ll be discussing what’s new for 2020, what we have planned for the future, and how these developments are impacting applications from Manufacturing to Building & Construction.

HOOPS Developer Day 

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Thursday, March 11th
8:00 AM - 11:30 AM PST | 11:00 AM - 2:30 PM EST 

HOOPS Developer Day gives you direct access to technical content and the opportunity to work hands-on with Tech Soft 3D staff.

  • Get technical insights from our Senior Global Director of Engineering, Antonio Carvalho, on our ongoing agile transformation. 
  • Explore new demos - No PowerPoint, just demos of our SDKs in action!
  • Participate in hands on training for the HOOPS Web and Native Platforms.
  • Engage in Q&A sessions on data access & publishing, graphics, and CAE solutions.